PAD問題。_!!蛻變!!_百度空間 想省面積,還是用CUP(TSMC的叫法,CIRCUIT UNDER PAD) 樓上能否詳細介紹一下core limited 和 pad limited 的區别。以及在什麼情況下是何種limited，如何判斷。多謝了。
Circuit-under-Pad (CUP) Technology Cuts Chip Size MagnaChip applied the technology to its 0.18/0.16 um process and was able to reduce chip size by placing the I/O circuit on the unused area under the pad.
Physically Robust Interconnect Design in CUP Bond Pads shrinking involves extensive use of circuit under pad (CUP) or bond over active ... CUP however, introduces more potential failure modes just as increased.
Reliability of circuits under pads for Au and Cu wire bonding The reliability of circuits (wiring and vias) under bond pads has been studied for both Au wire bonding and Cu wire bonding, for bond pads and wiring levels ...
(CUP) Strucure in Porous-SiOCH Film - IEEE Xplore Comprehensive Process Design for Low-cost Chip Packaging with Circuit-under-pad (CUP) Strucure in Porous-SiOCH Film. M. Tagami, H. Ohtake, M. Abe, F. Ito ...
Recent Development Work in IC Bond Pad Structure and ... 1. Recent Development Work in IC. Bond Pad Structure and Circuit. Under Pad. Stevan Hunter. Presented to IMAPS Student Chapter, UI, 29 SEP 2011 ...
鋁墊下電路型晶片銲線製程參數最佳化分析 本研究針對在先進的半導體晶圓製程上，鋁墊下的空間被充分的利用而發展之CUP (Circuit Under Pad) 結構，探討鋁墊下電路型晶片於銲線製程中因鋁墊龜裂所衍生 ...
下線申請相關注意事項 - 國家晶片系統設計中心 製程選擇建議：. 1. TN90GUTM將涵蓋RF、Analog、Mixed-Signal與Logic Circuit之電路應用需求，提供 .... 內含新版本ESD I/O PAD，並採用CUP(Circuit Under Pad).
博碩士論文etd-0728107-121433 詳細資訊 2007年7月28日 - 最近許多研究企圖想改善並使用鋁墊下方之空間，因而修改線路之設計之規則，鋁墊下出現有線路通過之結構(CUP)被發展出來。且需求大量的驗證 ...
